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Asian Semiconductor Manufacturer Chooses LPKF for Glass Processing

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On September 23, 2026, LPKF Laser & Electronics SE announced receiving a letter of intent from a leading Asian semiconductor packaging manufacturer. The agreement involves purchasing NEXAR LIDE systems to ramp up glass substrate production. This decision highlights LPKF's role as a key technology provider in glass-based advanced packaging for the semiconductor sector.

The manufacturer already uses LPKF systems and has fully qualified the LIDE technology. The letter of intent involves orders worth several million euros, indicating market confidence in LPKF's solutions. CEO Klaus Fiedler views this as a testament to their technological leadership in advanced packaging and AI sectors.

The demand for LPKF's glass processing solutions is driven by high-performance computing and AI needs. The company estimates a market potential of EUR 1.7 billion by 2030. LPKF is considering options to enhance its global presence and may explore financing alternatives like equity raise.

R. E.

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