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Autolink Expands in Europe with Advanced E/E Technology and Partnerships
Autolink, headquartered in Baden-Baden and Wolfsburg, Germany, has announced the European introduction of its AI Link 3.0 Deep Fusion EEA technology. This launch aims to address the growing complexity of vehicle systems and the demand for advanced integration, computing efficiency, and scalability among European automakers.
Unveiled at CES 2026, the Deep Fusion EEA employs the Qualcomm Snapdragon 8797 platform. It offers a high-speed optical communication backbone with capabilities of up to 256 Gbps bidirectional bandwidth and reduced latency. Scheduled for mass production by the end of 2026, this technology promises to streamline integration across diverse vehicle segments.
In partnership with the EDAG Group, Autolink is conducting a proof of concept to meet European vehicle development needs. Additionally, Autolink is enhancing its local presence with new offices in France and Germany and an R&D center and manufacturing facility in Romania.
R. P.
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