on SÜSS MicroTec AG (isin : DE000A1K0235)
SUSS MicroTec Launches XBC300 Gen2 D2W Hybrid Bonding Platform

SUSS MicroTec, a major player in semiconductor equipment, has unveiled the XBC300 Gen2 D2W platform, a comprehensive solution for die-to-wafer hybrid bonding. This new platform highlights SUSS's leadership in providing fully integrated bonding solutions tailored for high-precision requirements.
The XBC300 Gen2 D2W platform is designed for 200mm and 300mm substrates, featuring space savings of up to 40% and a precision of less than ±200 nm. The platform merges surface activation and die positioning in a singular automated process, enhancing cleanliness and control.
This platform is particularly suited for 3D IC technologies, improving efficiency in high-bandwidth memory applications. Developed in collaboration with SET Corporation, the platform integrates ultra-precise bonding technology, now available for demonstrations in Germany.
R. E.
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