BRIEF published on 08/07/2025 at 07:35, 10 months 9 days ago SUSS MicroTec AG Reports Strong H1 Sales Growth Financial Report Sales Growth Order Intake EBIT Margin Advanced Backend Solutions
PRESS RELEASE published on 08/07/2025 at 07:30, 10 months 9 days ago SUSS finishes first half of the year with significant sales growth SUSS MicroTec SE reports significant sales growth in the first half of 2025, with sales reaching €266.4 million. Order book at €325.8 million by June 30, 2025. EBIT margin at 15.7% Financial Report Sales Growth EBIT Margin Order Book SÜSS MicroTec SE
BRIEF published on 07/28/2025 at 19:46, 10 months 18 days ago SUSS MicroTec Adjusts 2025 Financial Guidance Financial Guidance EBIT Margin Gross Profit Margin Sales Target 2025 Forecast
PRESS RELEASE published on 07/28/2025 at 19:41, 10 months 18 days ago EQS-Adhoc: SUSS adjusts its guidance for gross profit margin and EBIT margin in financial year 2025 SUSS MicroTec SE adjusts 2025 guidance for gross profit margin and EBIT margin based on preliminary figures and ongoing analysis Financial Analysis Preliminary Figures SÜSS MicroTec SE Guidance Adjustment 2025 Forecast
BRIEF published on 06/04/2025 at 10:35, 1 year ago SUSS MicroTec SE AGM Approves 50% Dividend Increase and Re-Elects Jan Smits Shareholder Approval Dividend Increase Company Growth 2025 Outlook Jan Smits Re-Election
PRESS RELEASE published on 06/04/2025 at 10:30, 1 year ago Annual General Meeting approves dividend proposal and re-elects Jan Smits to the Supervisory Board SUSS MicroTec SE's Annual General Meeting approves 50% dividend increase to € 0.30 per share, re-elects Jan Smits to Supervisory Board, and presents growth plans for 2025 Supervisory Board Dividend Increase SÜSS MicroTec SE Jan Smits 2025 Growth Plans
BRIEF published on 05/26/2025 at 08:05, 1 year ago SUSS MicroTec Launches XBC300 Gen2 D2W Hybrid Bonding Platform SÜSS MicroTec Semiconductor Hybrid Bonding Die-to-wafer Bonding 3D IC Technologies
PRESS RELEASE published on 05/26/2025 at 08:00, 1 year ago SUSS presents the XBC300 Gen2 D2W platform – the integrated and precise solution for the future of die-to-wafer hybrid bonding SUSS introduces the XBC300 Gen2 D2W platform, offering high precision and space savings for die-to-wafer hybrid bonding in semiconductor manufacturing Semiconductor Industry Precision Hybrid Bonding SUSS XBC300 Gen2 D2W Platform
BRIEF published on 05/08/2025 at 07:35, 1 year 1 month ago SUSS MicroTec Reports Strong Sales Growth in Q1 2025 Sales Growth SÜSS MicroTec Semiconductor Q1 2025 Tariff Risks
PRESS RELEASE published on 05/08/2025 at 07:30, 1 year 1 month ago SUSS continues high sales growth in the first quarter of 2025 SUSS MicroTec SE reports 31.8% sales growth in Q1 2025, with margins and guidance confirmed. Key driver: bonder orders related to AI. Expansion plans in Taiwan progressing as planned Sales Growth SÜSS MicroTec SE Quarterly Statement Taiwan Expansion AI Bonder Orders
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