BRIEF published on 11/04/2024 at 07:30, 1 year 4 months ago SUSS MicroTec Expands Production Capacity in Taiwan Semiconductor Industry Production Capacity SÜSS MicroTec Taiwan Expansion Clean Room
PRESS RELEASE published on 11/04/2024 at 07:25, 1 year 4 months ago SUSS MicroTec signs long-term lease agreement for new production site in Taiwan SUSS MicroTec signs long-term lease agreement for new production site in Taiwan, doubling production capacity to meet high demand for semiconductor solutions Semiconductor Industry Capacity Expansion SÜSS MicroTec Taïwan Production Site
BRIEF published on 08/07/2024 at 07:30, 1 year 7 months ago SUSS MicroTec Reports Strong Q2 Growth and Margin Expansion Financial Report Order Intake Semiconductors Sales Expansion Q2 Growth
PRESS RELEASE published on 08/07/2024 at 07:25, 1 year 7 months ago SUSS MicroTec continues strong growth and significant margin expansion in the second quarter SUSS MicroTec SE reports strong growth, increased margins in Q2 2024. Order book at €450.0 million. Sales up 45.6% to €192.8 million in H1 2024. Gross profit margin improves to 39.8% Semiconductor Industry Financial Report Growth SÜSS MicroTec Margin Expansion
BRIEF published on 07/18/2024 at 19:28, 1 year 7 months ago SÜSS MicroTec Raises Full-Year 2024 Guidance Following Strong First Half-Year Performance Revenue Growth Order Intake EBIT Margin Financial Forecast Gross Profit
PRESS RELEASE published on 07/18/2024 at 19:23, 1 year 7 months ago EQS-Adhoc: SUSS MicroTec raises full-year 2024 guidance following strong first half-year performance SUSS MicroTec raises full-year 2024 guidance after strong first half-year performance. Positive sales and earnings momentum anticipated Sales Outlook Earnings SÜSS MicroTec Full-year Guidance
BRIEF published on 05/13/2024 at 09:05, 1 year 10 months ago SÜSS MicroTec Launches XBC300 Gen2: A Versatile Hybrid Bonding Platform Semiconductor Manufacturing SÜSS MicroTec Hybrid Bonding 3D Chip Integration XBC300 Gen2 D2W/W2W
PRESS RELEASE published on 05/13/2024 at 09:00, 1 year 10 months ago SUSS MicroTec presents hybrid bonding all-rounder XBC300 Gen2 D2W/W2W SUSS MicroTec SE introduces XBC300 Gen2 D2W/W2W, a hybrid bonding all-rounder platform enabling various bonding processes on 200mm and 300mm substrates, with space-saving features Innovation Semiconductor Industry SÜSS MicroTec SE Hybrid Bonding XBC300 Gen2 D2W/W2W
BRIEF published on 05/08/2024 at 07:35, 1 year 10 months ago SÜSS MicroTec Reports Strong Start to Fiscal Year 2024 with Promising Growth and Improved Margins Financial Performance Fiscal Year 2024 Growth SÜSS MicroTec Semiconductor
PRESS RELEASE published on 05/08/2024 at 07:30, 1 year 10 months ago SUSS MicroTec starts fiscal year 2024 with strong growth and improved margins SÜSS MicroTec SE announces strong growth and improved margins in Q1 2024, with a record order book of €456.9 million. Sales up 46.1% YoY to €93.5 million Sales Growth EBIT Margin Order Book SÜSS MicroTec SE Quarterly Statement
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